MPD

Data Rate Single / Array Part Number Product description Aperture Size(μm) Die Size (μm x μm) Thickness(μm) Pad Design Product Status
900~1700nm single XSJ-10-M-**** Top-illuminated Monitor PD Chip 200~10000 350 x 350~10374 x 10374 150~300 P-top, N-bottom MP
900~1700nm single XSJ-10-M-****-Q Four quadrants Monitor PD Chip 1500~5000 1770 x 1770~5400 x 5400 200~300 P-top, N-bottom MP
900~1700nm 1x8 Array PHG1-MS-1822-KB8 1x8 Array Bottom-illuminated Monitor PD Chip 210x178 2000 x 380 Pitch=250 150 GS on top MP
900~1700nm single PHG1-MS-1821-KB Bottom-illuminated Monitor PD Chip 210x178 380 x 250 150 GS on top MP
900~1700nm single PHG1-MS-200-KB Bottom-illuminated Monitor PD Chip 200 x 200 405 x 292 150 GS on top MP
900~1700nm single XSJ-10-EMPD-120R Edge-illuminated Monitor PD Chip 120 x 60 250 x 250 120 GS on top MP
900~1700nm single XSJ-10-EMPD-100R Edge-illuminated Monitor PD Chip 83*80 320 x 200 150 GS on top MP
900~1701nm single S500 Gas optical Sensor Chip 500 630 x 630 200 P-top, N-bottom MP
400~1700nm single S1000N Φ1000μm IR optical Sensor Chip 1000 1150 x 1150 200 P-top, N-bottom MP
900`1900nm single S1000R Optical Sensor Chip 1000 1150 x 1150 250 P-top, N-bottom MP
900`2300nm single S500A Extended Wavelength Optical Sensor Chip 500 630 x 630 200 P-top, N-bottom MP
900`2700nm single S500B Extended Wavelength Optical Sensor Chip 500 630 x 630 200 P-top, N-bottom MP
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