Marketing Dept.: Glen Liu
Tel: (+86) 181 8861 1190
Email:ge_liu@phograin.com

Technical Support: Max Xu
Tel: (+86) 181 8861 1183
Email: hu_xu@phograin.com

F4, Building A5, Nanshan i-Park, No.1001, Xueyuan Blvd, Nanshan District, Shenzhen City, Guangdong Prov., China.
Tel: (+86) 755 2371 2706

Building A8, Phoenix Bay Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Prov., China.
Tel: (+86) 516 8325 8257

No 7, Lorong Industri Sungai Lokan 2, Taman Industri Sungai Lokan, 13800 Butterworth, Penang, Malaysia

4X16Gbps Φ32μm 250μm Die Pitch 1X4 Array PIN PD Chip

P/N: XSJ-10-D5A-32-K4

This 4X16Gbps Array photodiode chip, which is top-illuminated and mesa structure high data rate PIN photodiode chip, active area size is Φ32μm. Its features are high responsivity, low capacitance, low dark current and excellent reliability, mainly combination with high performance 4X16Gbps quad channel transimpedance amplifiers(TIA),applications in long wavelength applications, high date rate up to 4X16Gbps with single mode fiber optical receiver.

Please click the button below to make an inquiry.

Click Inquiry

Description

Features

  1. Φ32μm active area.
  2. Ground-Signal-Ground (GSG) bond pad structure, 4X16Gbps array.
  3. Low dark current, low capacitance, high responsibility.
  4. Date rate: ≤16Gbps/channel.
  5. Die pitch: 250μm
  6. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
  7. 100% testing and inspection.

Applications

  1. 4X16Gbps CWDM CFP
  2. 40Gbps SFP+ LR4
  3. Parallel optical interconnection

Please fill out the form below and we will contact you as soon as possible.