Marketing Dept.: Glen Liu
Tel: (+86) 181 8861 1190
Email:ge_liu@phograin.com

Technical Support: Max Xu
Tel: (+86) 181 8861 1183
Email: hu_xu@phograin.com

F4, Building A5, Nanshan i-Park, No.1001, Xueyuan Blvd, Nanshan District, Shenzhen City, Guangdong Prov., China.
Tel: (+86) 755 2371 2706

Building A8, Phoenix Bay Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Prov., China.
Tel: (+86) 516 8325 8257

No 7, Lorong Industri Sungai Lokan 2, Taman Industri Sungai Lokan, 13800 Butterworth, Penang, Malaysia

4X25Gbps Φ20μm 250μm Die Pitch 1X4 Array PIN PD Chip

P/N: XSJ-10-D6A-20-K4

The 4X25G array 100Gbps photodetector chip is a high-speed digital PIN photodetector chip with top light input and mesa structure, and the size of the photosensitive area is Φ 20um. The main characteristics of the product are high responsiveness, low capacitance, low dark current, and high reliability. It is mainly paired with 4X25Gbps four channel TIA and is applied to long-distance, high-speed, and single-mode 4x25Gbps optical receivers.

Please click the button below to make an inquiry.

Click Inquiry

Description

Features

  1. Φ20μm active area.
  2. Ground-Signal-Ground (GSG) bond pad structure, 4X25G array.
  3. Low dark current, low capacitance, high responsibility.
  4. Date rate: ≥ 25Gbps/channel.
  5. Die pitch: 250μm
  6. 100% testing and inspection.
  7. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
  8. RoHS2.0 (2011/65/EU) compliant.

Applications

  1. IEEE 100 Gigabit Ethernet.
  2. 100G CWDM4,PSM4,CLR4
  3. 100G(4X25Gbps) links.

Please fill out the form below and we will contact you as soon as possible.