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4X25Gbps Φ20μm 250μm Die Pitch 1X4 Array PIN PD Chip

P/N: XSJ-10-D6A-20-K4

The 4X25G array 100Gbps photodetector chip is a high-speed digital PIN photodetector chip with top light input and mesa structure, and the size of the photosensitive area is Φ 20um. The main characteristics of the product are high responsiveness, low capacitance, low dark current, and high reliability. It is mainly paired with 4X25Gbps four channel TIA and is applied to long-distance, high-speed, and single-mode 4x25Gbps optical receivers.

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Description

Features

  1. Φ20μm active area.
  2. Ground-Signal-Ground (GSG) bond pad structure, 4X25G array.
  3. Low dark current, low capacitance, high responsibility.
  4. Date rate: ≥ 25Gbps/channel.
  5. Die pitch: 250μm
  6. 100% testing and inspection.
  7. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
  8. RoHS2.0 (2011/65/EU) compliant.

Applications

  1. IEEE 100 Gigabit Ethernet.
  2. 100G CWDM4，PSM4，CLR4
  3. 100G(4X25Gbps) links.

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