Marketing Dept.: Glen Liu
Tel: (+86) 181 8861 1190
Email:ge_liu@phograin.com

Technical Support: Max Xu
Tel: (+86) 181 8861 1183
Email: hu_xu@phograin.com

F4, Building A5, Nanshan i-Park, No.1001, Xueyuan Blvd, Nanshan District, Shenzhen City, Guangdong Prov., China.
Tel: (+86) 755 2371 2706

Building A8, Phoenix Bay Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Prov., China.
Tel: (+86) 516 8325 8257

为向您提供更多的优质内容，本网站使用 cookies 分析技术。若继续阅览本网站内容，即表示您同意我们使用 cookies，若不同意请关闭浏览器的 cookie 功能，关于更多资讯请阅读 隐私政策、法律申明

4x10Gbps Φ50μm 250μm Die Pitch 1x4 Array PIN PD Chip

P/N: XSJ-10-D5-50H-K4

The high-speed 4X10Gbps photodetector chip is an InGaAs/I InP PIN structure and front illuminated type, characterized by high responsiveness, low capacitance, and low dark current. The size of the photosensitive area is 50um, and the P and N pads are designed at the top for easy packaging of solder wires. Mainly paired with 4X10Gbps four channel TIA, it is used for long-distance, high-speed, and single-mode 4X10G bps optical receivers and data communication.

Please click the button below to make an inquiry.

Click Inquiry

Description

Features

  1. Φ50μm active area.
  2. Ground-Signal-Ground (GSG) bond pad structure, 4X10Gbps array.
  3. Low dark current, low capacitance, high responsibility.
  4. Die pitch: 250μm
  5. 100% testing and inspection.
  6. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
  7. RoHS2.0 (2011/65/EU) compliant.

Applications

  1. 40Gbps QSFP+ LR4

Please fill out the form below and we will contact you as soon as possible.

    Related products