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Tel: (+86) 181 8861 1190
Email:ge_liu@phograin.com

Technical Support: Max Xu
Tel: (+86) 181 8861 1183
Email: hu_xu@phograin.com

F4, Building A5, Nanshan i-Park, No.1001, Xueyuan Blvd, Nanshan District, Shenzhen City, Guangdong Prov., China.
Tel: (+86) 755 2371 2706

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Tel: (+86) 516 8325 8257

Φ3000μm Monitor PD Chip

P/N: XSJ-10-M-3000

This top-illuminated InGaAs/InP monitor PIN photodiode chip with large active area, which is planar structure, anode on top and cathode on back. Active area size is Φ3000μm, and high responsivity in the wavelength region from 980nm to 1620nm. Application in monitoring the optical power output from the back facet of various LD.

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Description

Features

  1. Planar structure on n+ InP substrate with top anode contact.
  2. Φ3000μm active area.
  3. High responsibility.
  4. Low dark current.
  5. Low operating bias voltage.
  6. -40℃ to 85℃ operation range.
  7. Excellent reliability: All chips have passed the qualification requirements as specified by Telcordia -GR-468-CORE.
  8. 100% testing and inspection.
  9. Customized chip dimension is available. 

Applications

  1. Back facet laser power monitoring.

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